PP-1 Thermal Characterisation

Clarification of Error Factors in Thermal Impedance Measurement Using SiC-MOSFET Body Diodes Compared to SWITCH MOS

Kato, Fumiki; Sato, Shinji; Harada, Shinsuke; Hozoji, Hiroshi; Sakai, Aki; Watanabe, Kinuyo; Yamaguchi, Hiroshi; Sato, Hiroshi
National Institute of Advanced Industrial Science and Technology, Ibaraki, Japan

Comparison of GaN HEMTs Thermal Results through Various Measurements Methodologies: Validation with 3D Simulation

Jakani, Anass; Sommet, Raphael; Gaillard, Florent; Nallatamby, Jean-Christophe
XLIM, Université de Limoges, Limoges, France

Effects of Auto-Calibration Hysteresis

Wong, Hon (1); Parry, John (2); Farkas, Gabor (2)
1: Siemens Digital Industries Software, Singapore, Singapore; 2: Siemens Digital Industries Software, United Kingdom

Impact of a Crack on Heat Flux in a Solder Joint between an Electronic Component Pin and a Printed Circuit Board

Kozlov, Alexander
Omsk State Technical University, Omsk, Russian Federation

Measuring the RthJC of Power Semiconductor Components Using Short Pulses

Singh, Sujay (1); Vass-Varnai, Andras (2); Proulx, Joseph (2)
1: On Semiconductor, Phoenix, United States; 2: Siemens, United States

Optimization-based Network Identification for Thermal Transient Measurements on LEDs

Ziegeler, Nils Jonas (1); Nolte, Peter W. (2); Schweizer, Stefan (1,2)
1: Fachhochschule Südwestfalen, Iserlohn, Germany; 2: Fraunhofer IMWS, Soest, Germany

Study of Aging Time Effect on the EMI Evolution of Power RF LDMOS Transistor in DC-DC Buck Converter Circuit

Tlig, Mohamed
Université de Sousse, Ecole Nationale d’Ingénieurs de Sousse, LATIS- Laboratory of Advanced Technology and Intelligent Systems, Sousse, Tunisia

Thermal Effect on Performance of N-MOSFET Transistor under Pulsed RF Tests

Almusallam, Ahmed
Umm Al-Qura University, Mekka, Saudi Arabia

PP-2 Reliability and Failure Analysis

A Parametric Simulative Study for Si and SiC Semiconductor Devices under Various Accelerated Testing Conditions Using Rate- and Temperature Dependent Inelastic Material Data

Forndran, Freerik (1); Heilmann, Jens (2); Leicht, Markus (1); Wunderle, Bernhard (2)
1: Vitesco Technologies Germany GmbH, Berlin, Germany; 2: Chemnitz University of Technology, Chemnitz, Germany

Comparison of Experimental and Estimated Fusing Current of Gold (Au) and Copper (Cu) Bonding Wires in Semiconductor IC Packages

Flauta, Randolph Estal (1); Zhou, Zhou (1); Chen, Haibin (2); Fan, Haibo (1)
1: Nexperia, Hong Kong S.A.R., China; 2: Hong Kong University of Science and Technology, Hong Kong S.A.R., China

Indirect In-Situ Junction Temperature Measurement for Condition Monitoring of GaN HEMT Devices during Application Related Reliability Testing

Ofner, Sybille (1); Glavanovics, Michael (1); Mütze, Annette (2)
1: KAI GmbH, Villach, Austria; 2: TU Graz, Graz, Austria

Investigation of the Effect of PCB Inner Copper Layer Plastic Deformation on Solder Joint Fatigue Simulations for Cyclic Mechanical Bending Stress Tests

Zhang, Maofen (1); Chan, Yuen Sing (1); Niessner, Martin Richard (1); Altieri-Weimar, Paola (1); Wunderle, Bernhard (2)
1: Infineon Technologies AG, Neubiberg, Germany; 2: TU Chemnitz, Chemnitz, Germany

PV Fault Detection through IR Thermography: Using EMPHASIS under Uneven Environmental Conditions

Scognamillo, Ciro (1); Catalano, Antonio Pio (1); Guerriero, Pierluigi (1); Daliento, Santolo (1); Codecasa, Lorenzo (2); d'Alessandro, Vincenzo (1)
1: Department of Electrical Engineering and Information Technology, University of Naples Federico II, Naples, Italy; 2: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

Rapid Failure Analysis of Installed LED Luminaire Trough Standardized Processes

Hegedűs, János; Hantos, Gusztáv; Szabó, Péter Gábor; Poppe, András
Budapest University of Technology and Economics, Budapest, Hungary

Reliability of SAC+ Solders for LED Packages

Elger, Gordon Patrick Rudolf; Schmid, Maximilian
Technische Hochschule Ingolstadt, Ingolstadt, Germany

Research on Heat Dissipation Performance and Long-term Reliability of the Flapping Wing Cooling Technology Applied to the 5G Communications Equipment

Guo, Yanhua; Zhang, Xianming; Lan, Daiyan; Zhu, Yue
Zhongxing Telecommunication Equipment(ZTE) Corporation, ShenZhen City, People´s Republic of China

PP-3 Thermal Modeling

AI-TWILIGHT: AI-digital TWIn for LIGHTing – A New European Project

Martin, Genevieve (1); Poppe, Andras (2); Schoeps, Sebastian (3); Kraker, Elke (4); Marty, Christophe (5); Soer, Wouter (6); Yu, Joan (1)
1: Signify (Philips Lighting), Eindhoven, The Netherlands; 2: Budapest University of Technology and Economics, Budapest, Hungary; 3: Technical University of Darmstadt, Darmstadt, Germany; 4: Materials Center Leoben Forschung GmbH, Leoben, Austria; 5: Ingélux S.A.S., France; 6: Lumileds Netherlands B.V., the Netherlands

Applying Delphi-like CTM Partitioning on Electrothermally Connected FANTASTIC BCI-ROMs

Alkhenaizi, Mahmood; Blackmore, Byron; Donnelly, Mike
Siemens Digital Industries Software, Plano, United States

Compact Electro-Thermal Models for Integrated Systems

Codecasa, Lorenzo (1); d'Alessandro, Vincenzo (2)
1: Politecnico di Milano, Milan, Italy; 2: Università Federico II, Naples, Italy

Comparative Multiphysics Simulation of VO2 Based Lateral Devices

Al-abassi, Salam A. W.; Darwish, Mahmoud; Pohl, László; Mizsei, János; Neumann, Péter
Budapest University of Technology and Economics, Budapest, Hungary

Modeling of Thermal Exchange in Photovoltaïc Module (PV) Lamination Process: Impact of Module Packaging, Laminator Configuration and Lamination Recipe

Chambion, Bertrand (1); Rahmoum, Ichrak (1,2); Le Carre, Tristan (1); Mofakhami, Eeva (1); Derrier, Aude (1); Bouvard, Jean-Luc (2); Bouchard, Pierre-Olivier (2)
1: Univ. Grenoble Alpes, CEA, LITEN, Department for Solar Energy, National Institute of Solar Energy, Le Bourget du Lac, France.; 2: CEMEF Mines ParisTech, PSL Research University, Sophia-Antipolis, France

Molecular Dynamics Simulations Supporting the Development of a Continuum Model of Heat Transport in Nanowires

Bejenari, Igor (1); Burenkov, Alexander (1); Pichler, Peter (1,2); Deretzis, Ioannis (3); Sciuto, Alberto (3); La Magna, Antonino (3)
1: Fraunhofer IISB, Erlangen, Germany; 2: Chair of Electron Devices, University of Erlangen-Nuremberg, Erlangen, Germany; 3: CNR-IMM, Catania, Italy

Multiphysics Reduced Order Modelling of a Packaged Laser Diode

Grosso, Giovanna (1); Moldaschl, Thomas (1); Fuger, Rene (2); Binder, Alfred (1)
1: Silicon Austria Labs, Austria; 2: CADFEM Austria, Vienna, Austria

Thermal Simulation of Processing-in-Memory Devices Using HotSpot 7.0

Han, Jun-Han; West, Robert E.; Skadron, Kevin; Stan, Mircea R.
University of Virginia, Charlottesville, United States

TONIC: Tool for Nonlinear BCI CTMs of Integrated Circuits

Codecasa, Lorenzo (1); d'Alessandro, Vincenzo (2); D'Amore, Dario (1)
1: Politecnico di Milano, Milan, Italy; 2: Università Federico II, Naples, Italy

PP-4 Thermal Phenomena, Materials and Cooling Concepts

A Comparison of the Thermohydraulic Performance of Oil-Cooled Heat Sink Geometries for Power Electronics

Vander Heyde, Judith (1,2); T’Jollyn, Ilya (1,2); Rogiers, Jana (1,2); Schoonjans, Thomas (1,2); Nonneman, Jasper (1,2); Schlimpert, Stephan (3); De Paepe, Michel (1,2)
1: Ghent University, Gent, Belgium; 2: FlandersMake@UGent – Core lab EEDT-MP, Gent, Belgium; 3: FlandersMake vzw – CoreLab MotionS, Belgium

Application of Vanadium Dioxide for Thermal Sensing

Darwish, Mahmoud; Al-abassi, Salam A. W.; Neumann, Péter; Mizsei, János; Pohl, László
Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Budapest, Hungary

Impact of Ambient Temperature Influences on the Cooling Performance of Heat Sinks under Forced Air Convection

Schacht, Ralph; Nowak, Torsten
Brandenburg University of Technology Cottbus-Senftenberg, Cottbus, Germany

Study of the Thermal Behavior of Double-sided Cooled Power Modules

Catalano, Antonio Pio (1); Scognamillo, Ciro (1); Castellazzi, Alberto (2); Codecasa, Lorenzo (3); d'Alessandro, Vincenzo (1)
1: Department of Electrical Engineering and Information Technology, University of Naples “Federico II”, Naples, Italy; 2: Solid-State Power Processing (SP2) Lab, Department of Mechanical and Electrical Systems, Faculty of Engineering, Kyoto University of Advanced Science (KUAS), Kyoto, Japan; 3: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

Thermal Diode Based on the Spatiotemporal Modulation of Thermal Properties

Ordonez, Jose (1,2); Guo, Yangyu (2); Alvarado-Gil, Juan (3); Volz, Sebastian (1,2); Nomura, Masahiro (2)
1: LIMMS, CNRS, Tokyo, Japan; 2: Institute of Industrial Science, The University of Tokyo, Tokyo, Japan; 3: Applied Physics Department, CINVESTAV-IPN, Mexico City, Mexico

Thermal Fluid Simulation Modeling and Fatigue Analysis of Double-Sided Cooling Power Module Based on Thermal Transient Test

Hara, Tomoaki (1); Aoki, Yoshitaka (1); Funaki, Tsuyoshi (2)
1: Siemens DI Software, Presales Division, Siemens K.K., Tokyo, Japan; 2: Division of Electrical, Electronic, and Information Engineering, Osaka University, Osaka, Japan